About eSiliconeSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets

Semiconductor design and manufacturing services custom embedded memory IP specialty memory IP IC design optimization (power performance area yield) SerDes and other IP integration multi-project wafer (MPW) services 2.5D and 3D packaging high bandwidth memory HBM PHY FinFET ASIC design and manufacturing services FinFET-class custom embedded memory IP high bandwidth memory HBM2/2.5D solutions SerDes 7nm & 14/16nm HBM2 PHY 2.5D packaging 7nm & 14/16nm HBM2 PHY FinFET-class market-specific IP platforms HBM2/2.5D solutions 56G/112G PAM4 & NRZ SerDes Family Ternary CAM Highly configurable 7nm IP platform 56G/112G PAM4 & NRZ SerDes Family Networking ASICs 5G infrastructure ASICs AI and ML ASICs High-performance computing ASICs IP optimization B2B Semiconductors Semiconductors and Related Devices Electrical Electronic Manufacturing Manufacturing