Electrical/electronic Manufacturing - Kennett Square, Pennsylvania, United States
For microelectronic component level hermetic packages, MCL provides complete encapsulation services including materials design, process development, testing, prototyping and production. Supported processes including both Weld or AuSn solder cover seal, with deliverables exceeding all relevant standards including MIL-STD-883 Test Method 1014 Seal; 2009 External Visual; 1009 Salt Atmosphere; 2012 Lid Seal Void Rejection Criteria and JEDEC JESD9C. MCL's processes are guaranteed for the life of the package and include a $0 license fee for the customer package part number.
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