MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer "one-stop-shop" solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com.

Eutectic Die Bonding Conductive Epoxy Dispensing Flip Chip Bonding Epoxy Die Attach Thermal Compression Bonding 1 Micron 3 Micron 5 Micron and 8 Micron Assembly Advanced Packaging Epoxy Stamping Photonics Packaging Optoelectronics Packaging Epoxy Die Bonding Die Bonder Epoxy Dispenser Die Bonding 5 Micron Assembly Eutectic Bonding Industrial Equipment Industrial Machinery and Equipment Industrial Automation