Semiconductors - Bayan Lepas, Penang, Malaysia
Pac Tech, member of the Nagase group, is a world leading provider of advanced wafer bumping, packaging and solder-ball placement equipment. Pac Tech also provides state of the art worldwide contract services for low cost wafer level bumping and packaging offering a competitive pricing at highest quality.
reCAPTCHA
Hubspot
Gravity Forms
Google Tag Manager
Microsoft Office 365