PacTech - Packaging Technologies

Machinery - Nauen, Brandenburg, Germany

PacTech - Packaging Technologies Details

Advanced equipment manufacturer, wafer level packaging (WLP) subcontracting service provider and chemistry supplier specialized in electroless under bump metallization (UBM), solder balling and back-end services with more than 25 years of experience after spinning off from the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany.Mother company: Nagase & Co., Ltd. with headquarters in Tokyo, Japan Facilities: Nauen, Germany (headquarters), Santa Clara, CA, USA & Penang, Malaysia

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Website:
Employees: 41
HQ: +49 3321 4495504
Location: Nauen, Brandenburg, Germany
Revenue: 10M

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