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Technology for Advanced Diagnostic Metrology and Thermal Processing. Specific Non-Contact and Non-Invasive Technologies to address Wafer Stress, Dopant Concentration, Uniformity and Activation, In-line Process monitoring, Crystal quality, Warpage, Band-gap and many other physical conditions of processing. Technologies allow characterization at surface and into the silicon for Wafer Diagnostic Mapping.Technologies include High Stability, Multi-Wavelength Raman Spectroscopy, Photoluminescence, Surface Profilometry as well as Iso-Thermal RTP.
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