Febe Ferrer

Manager, Sales Customer Service at Amkor Technology - Tempe, AZ, US

Febe Ferrer's Colleagues at Amkor Technology
Sharon Fay

Accounts Receivable Manager

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Kevin Kan

Vice President, Product Marketing & Corporate Development

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Anthony DePaoli

Vice President, Compliance

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Vik Chaudhry

Sr. Director of Product Marketing and Business Development

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Sophie Olson

Sr. Manager, Material Development & Technology Integration

Contact Sophie Olson

Ted Adlam

Sr. Director System-in-Package Product Line

Contact Ted Adlam

Michael Flatley

Manager, MLF Products - Leadframe Products

Contact Michael Flatley

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Febe Ferrer's Contact Details
HQ
480-821-5000
Location
Tempe, Arizona, United States
Company
Amkor Technology
Febe Ferrer's Company Details
Amkor Technology logo, Amkor Technology contact details

Amkor Technology

Tempe, AZ, US • >10000 Employees
Semiconductors

Amkor Technology is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor's operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Semiconductors IC Test Package Design Wafer Bumping MEMS & Sensors Wafer Level Packaging Copper Pillar 3D Packaging TSV Copper Wirebond Flip Chip Package-on-Package SiP TMV Chip-on-Chip Wafer Test Die Processing & Inspection RF/Wireless Design Strip Test IC Design Leadframe Laminate WLFO Semiconductor CSP BGA Power Discretes MEMS & Sensors B2B Semiconductors and Related Devices
Details about Amkor Technology
Frequently Asked Questions about Febe Ferrer
Febe Ferrer currently works for Amkor Technology.
Febe Ferrer's role at Amkor Technology is Manager, Sales Customer Service.
Febe Ferrer's email address is ***@amkor.com. To view Febe Ferrer's full email address, please signup to ConnectPlex.
Febe Ferrer works in the Semiconductors industry.
Febe Ferrer's colleagues at Amkor Technology are Sharon Fay, Kevin Kan, Anthony DePaoli, Vik Chaudhry, Sophie Olson, Ted Adlam, Michael Flatley and others.
Febe Ferrer's phone number is 480-821-5000
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