Huang Renyung

Advanced Packaging Technical Development Senior Engineer at Micron Technology - Boise, Idaho, US

Huang Renyung's Colleagues at Micron Technology
Varaprasad Ramoju

SENIOR ENGINEER SSD FIRMWARE

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Yijing Xiong

Process and Equipment Engineer

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Varadha Raj

Technical specialist

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Winglam Lai

Manufacturing Engineer

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Sunil Gopakumar

Director Of Hardware Engineering

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Jishnu Eringat

Senior Equipment Engineer

Contact Jishnu Eringat

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Huang Renyung's Contact Details
HQ
(208) 368-4000
Location
Taipei,Taiwan
Company
Micron Technology
Huang Renyung's Company Details
Micron Technology logo, Micron Technology contact details

Micron Technology

Boise, Idaho, US • 29004 Employees
Semiconductors

Micron is a world leader in innovative memory solutions that transform how the world uses information. We have approximately 40,000 team members in 17 countries who work with the world’s most trusted brands, delivering memory and storage systems for a broad range of applications and sparking countless possibilities in technology.

Memory Solutions Semiconductor Data Storage Flash Memory Computer Memory Solid State Drives Storage Services
Details about Micron Technology
Frequently Asked Questions about Huang Renyung
Huang Renyung currently works for Micron Technology.
Huang Renyung's role at Micron Technology is Advanced Packaging Technical Development Senior Engineer.
Huang Renyung's email address is ***@micron.com. To view Huang Renyung's full email address, please signup to ConnectPlex.
Huang Renyung works in the Semiconductors industry.
Huang Renyung's colleagues at Micron Technology are Varaprasad Ramoju, Yijing Xiong, Varadha Raj, Winglam Lai, Sunil Gopakumar, Vanne Caballero, Jishnu Eringat and others.
Huang Renyung's phone number is (208) 368-4000
See more information about Huang Renyung