Jen Figueroa

Engineer at Amkor Technology - Tempe, AZ, US

Jen Figueroa's Colleagues at Amkor Technology
Eden Solomo

CS Representative / Planning Engineer

Contact Eden Solomo

Janet Park

Sales Customer Service Manager/Account Manager

Contact Janet Park

Hsin-Chen Liu

製程整合工程師

Contact Hsin-Chen Liu

Lee Adonis

Equipment Specialist

Contact Lee Adonis

View All Jen Figueroa's Colleagues
Jen Figueroa's Contact Details
HQ
480-821-5000
Location
Metro Manila,Philippines
Company
Amkor Technology
Jen Figueroa's Company Details
Amkor Technology logo, Amkor Technology contact details

Amkor Technology

Tempe, AZ, US • >10000 Employees
Semiconductors

Amkor Technology is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor's operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Semiconductors IC Test Package Design Wafer Bumping MEMS & Sensors Wafer Level Packaging Copper Pillar 3D Packaging TSV Copper Wirebond Flip Chip Package-on-Package SiP TMV Chip-on-Chip Wafer Test Die Processing & Inspection RF/Wireless Design Strip Test IC Design Leadframe Laminate WLFO Semiconductor CSP BGA Power Discretes MEMS & Sensors B2B Semiconductors and Related Devices
Details about Amkor Technology
Frequently Asked Questions about Jen Figueroa
Jen Figueroa currently works for Amkor Technology, Inc..
Jen Figueroa's role at Amkor Technology, Inc. is Engineer.
Jen Figueroa's email address is ***@amkor.com. To view Jen Figueroa's full email address, please signup to ConnectPlex.
Jen Figueroa works in the Semiconductors industry.
Jen Figueroa's colleagues at Amkor Technology are Rowena Ferrer, Eden Solomo, Neil Cuyugan, Rachel Santillan, Janet Park, Hsin-Chen Liu, Lee Adonis and others.
Jen Figueroa's phone number is 480-821-5000
See more information about Jen Figueroa