Kerry Quon

Manager II B2B / RosettaNet Integration at Amkor Technology - Tempe, AZ, US

Kerry Quon's Colleagues at Amkor Technology
Mark Gorecki

Staff Engineer - Design Automation R&D Design Center

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Michael Johnson

Senior Director, Mainstream BU

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Shaun Bowers

Vice President, Package Development and Technology Integration

Contact Shaun Bowers

Scott Varga

Digital Marketing Analyst

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Umesh Manathkar

Corporate VP & Chief Information Officer

Contact Umesh Manathkar

Vin Sullivan

Director of Business Operations

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Kerry Quon's Contact Details
HQ
480-821-5000
Location
Phoenix, Arizona Area
Company
Amkor Technology
Kerry Quon's Company Details
Amkor Technology logo, Amkor Technology contact details

Amkor Technology

Tempe, AZ, US • >10000 Employees
Semiconductors

Amkor Technology is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor's operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Semiconductors IC Test Package Design Wafer Bumping MEMS & Sensors Wafer Level Packaging Copper Pillar 3D Packaging TSV Copper Wirebond Flip Chip Package-on-Package SiP TMV Chip-on-Chip Wafer Test Die Processing & Inspection RF/Wireless Design Strip Test IC Design Leadframe Laminate WLFO Semiconductor CSP BGA Power Discretes MEMS & Sensors B2B Semiconductors and Related Devices
Details about Amkor Technology
Frequently Asked Questions about Kerry Quon
Kerry Quon currently works for Amkor Technology.
Kerry Quon's role at Amkor Technology is Manager II B2B / RosettaNet Integration.
Kerry Quon's email address is ***@amkor.com. To view Kerry Quon's full email address, please signup to ConnectPlex.
Kerry Quon works in the Semiconductors industry.
Kerry Quon's colleagues at Amkor Technology are Beverly Freet, Mark Gorecki, Michael Johnson, Shaun Bowers, Scott Varga, Umesh Manathkar, Vin Sullivan and others.
Kerry Quon's phone number is 480-821-5000
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