Liao JuiYang

RDSS at Amkor Technology, Inc. - Tempe, Arizona, US

Liao JuiYang's Colleagues at Amkor Technology, Inc.
Yuan-Chih Wang

Manufacturing Planner Controller

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Mark Villamor

Information Technology Support Engineer

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Koji Tani

Head of Power Products

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Saad Quraishi

Director , Information Technology Infrastructure Group

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Liao JuiYang's Contact Details
HQ
(480) 821-5000
Location
Company
Amkor Technology, Inc.
Liao JuiYang's Company Details
Amkor Technology, Inc. logo, Amkor Technology, Inc. contact details

Amkor Technology, Inc.

Tempe, Arizona, US • >10000 Employees
Semiconductors

Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Semiconductors IC Test Package Design Wafer Bumping MEMS & Sensors Wafer Level Packaging Copper Pillar 3D Packaging TSV Copper Wirebond Flip Chip Package-on-Package SiP TMV Chip-on-Chip Wafer Test Die Processing & Inspection RF/Wireless Design Strip Test IC Design Leadframe Laminate WLFO Semiconductor CSP BGA Power Discretes MEMS & Sensors B2B Semiconductors and Related Devices
Details about Amkor Technology, Inc.
Frequently Asked Questions about Liao JuiYang
Liao JuiYang currently works for Amkor Technology, Inc..
Liao JuiYang's role at Amkor Technology, Inc. is RDSS.
Liao JuiYang's email address is ***@amkor.com. To view Liao JuiYang's full email address, please signup to ConnectPlex.
Liao JuiYang works in the Semiconductors industry.
Liao JuiYang's colleagues at Amkor Technology, Inc. are Yuan-Chih Wang, Mark Villamor, Realyn Encarnacion, Celsa Vesinal, Koji Tani, Saad Quraishi, King Yaamim and others.
Liao JuiYang's phone number is (480) 821-5000
See more information about Liao JuiYang