Mariappan Hariharaputhiran
Principal Engineer, Process Integration, 10s/20s CMOS/Periphery and Cell Engineering - 3DxP at IM Flash Technologies LLC - Lehi, UT, US
Mariappan Hariharaputhiran's Colleagues at IM Flash Technologies LLC
Mariappan Hariharaputhiran's Contact Details
801-767-4000
Lehi, Utah
IM Flash Technologies LLC
Mariappan Hariharaputhiran's Company Details
IM Flash is a joint venture between Intel and Micron and we are the only company in the world making 3D XPoint, a new transistor-less chip, which is the first of its kind. You can find 3D XPoint in Intel Optane solid state drives (SSD), which are used by data centers and high end computers. Come learn more about IM Flash. There are no limits to the opportunities ahead! We are making the memory that makes the world mobile. IM Flash combines the best from Intel and Micron - Intel's multi-level cell technology and history of innovation plus Micron's NAND technology and efficient manufacturing – to create a culture all our own.