Mark Bloomberg

Vice President Of Engineering at LSP Technologies, Inc. - Dublin, OH, US

Mark Bloomberg's Colleagues at LSP Technologies, Inc.
Derik Burkholder

Head of Mechanical Engineering

Contact Derik Burkholder

Stanley Bovid

Director of Materials Research

Contact Stanley Bovid

Micheal Kattoura

Materials Research Engineer - Business Development Team

Contact Micheal Kattoura

Corey Howard

Project Lead Engineer

Contact Corey Howard

View All Mark Bloomberg's Colleagues
Mark Bloomberg's Contact Details
HQ
614-718-3000
Location
Columbus, Ohio, United States
Company
LSP Technologies, Inc.
Mark Bloomberg's Company Details

LSP Technologies, Inc.

Dublin, OH, US • 100 - 249 Employees
Airlines/Air Couriers

LSP Technologies, Inc. is the world's premiere Laser Peening production services and equipment provider. LSPT operates an AS9100/ISO9001 accredited Laser Peening production and equipment build facility in Dublin, Ohio.Laser Peening ServicesLSPT processes thousands of parts each year for major OEMs in the aerospace, power generation, transportation, and forging industries. LSPT maintains a robust Laser Peening production infrastructure and supply chain, serving public and private entities around the U.S. and the world.Laser Peening, or Laser Shock Peening (LSP), imparts superior metal enhancement, reliability, and performance with improved fatigue life and damage tolerance. The process imparts compressive residual stresses up to ten times deeper than shot peening. Laser Peening significantly extends component service life by increasing resistance to:High-Cycle FatigueForeign Object Damage (FOD)Stress Corrosion CrackingFretting ErosionLaser Peening EquipmentLSPT sells 1 or 2 beam production Procudo® Laser Peening Systems, and custom application systems. These high-powered, high-pulse-rate, turn-key production systems are designed for rapid integration into manufacturing processes. Procudo® LSP Systems can be customized to meet specific production requirements, and include a license to LSPT's intellectual property along with training, ongoing equipment service, and long-term technical support. Procudo® LSP Systems are currently being installed in China and Europe, and are available to industries and researchers around the world.Composite Bond Inspection TechnologyLSP Technologies has also pioneered an innovative nondestructive method for evaluating adhesive bond strength. Laser Bond Inspection (LBI) utilizes laser-generated stress waves to interrogate adhesive bonds at selected strength values. LBI can detect weak bonds, kissing bonds, and variations in bond strength, and can perform nondestructive inspections on bonded composite structures.

Laser Peening Laser Shock Peening Laser Bond Inspection High Energy Lasers Contract Research and Development Surface Enhancement Fatigue and Damage Tolerance Stress Engineering Airlines/Air Couriers Air Transportation Scheduled Airlines/Aviation
Details about LSP Technologies, Inc.
Frequently Asked Questions about Mark Bloomberg
Mark Bloomberg currently works for LSP Technologies, Inc..
Mark Bloomberg's role at LSP Technologies, Inc. is Vice President Of Engineering.
Mark Bloomberg's email address is ***@lsptechnologies.com. To view Mark Bloomberg's full email address, please signup to ConnectPlex.
Mark Bloomberg works in the Airlines/Air Couriers industry.
Mark Bloomberg's colleagues at LSP Technologies, Inc. are Caryl Kindig, Derik Burkholder, Brent Black, Stanley Bovid, Micheal Kattoura, Thuan Nguyen, Corey Howard and others.
Mark Bloomberg's phone number is 614-718-3000
See more information about Mark Bloomberg