Michelle Buckingham's Contact Details

Michelle Buckingham's Company Details

LSP Technologies, Inc. is the world's premiere Laser Peening production services and equipment provider. LSPT operates an AS9100/ISO9001 accredited Laser Peening production and equipment build facility in Dublin, Ohio.Laser Peening ServicesLSPT processes thousands of parts each year for major OEMs in the aerospace, power generation, transportation, and forging industries. LSPT maintains a robust Laser Peening production infrastructure and supply chain, serving public and private entities around the U.S. and the world.Laser Peening, or Laser Shock Peening (LSP), imparts superior metal enhancement, reliability, and performance with improved fatigue life and damage tolerance. The process imparts compressive residual stresses up to ten times deeper than shot peening. Laser Peening significantly extends component service life by increasing resistance to:High-Cycle FatigueForeign Object Damage (FOD)Stress Corrosion CrackingFretting ErosionLaser Peening EquipmentLSPT sells 1 or 2 beam production Procudo® Laser Peening Systems, and custom application systems. These high-powered, high-pulse-rate, turn-key production systems are designed for rapid integration into manufacturing processes. Procudo® LSP Systems can be customized to meet specific production requirements, and include a license to LSPT's intellectual property along with training, ongoing equipment service, and long-term technical support. Procudo® LSP Systems are currently being installed in China and Europe, and are available to industries and researchers around the world.Composite Bond Inspection TechnologyLSP Technologies has also pioneered an innovative nondestructive method for evaluating adhesive bond strength. Laser Bond Inspection (LBI) utilizes laser-generated stress waves to interrogate adhesive bonds at selected strength values. LBI can detect weak bonds, kissing bonds, and variations in bond strength, and can perform nondestructive inspections on bonded composite structures.