Michiel Hamblok

Junior Hardware Engineer at BOND Mobility - Palo Alto, CA, US

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BOND Mobility
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BOND Mobility

Palo Alto, CA, US • 100 - 249 Employees
SaaS

BOND was born with the vision of transforming societies and how cities move, aiming to provide more options for the citizens. As the world's first station-less e-Bike sharing operator, BOND Mobility creates Swiss designed premium e-Bikes that go up to 45kph. Founded in Switzerland in 2016, it has headquarters in Zurich, Switzerland, and Palo Alto, California. BOND Mobility is operating in numerous European cities and rapidly approaching new cities globally. According to RED Herring TOP 100, BOND Mobility is one of Europe's fastest growing tech startups in 2020.The company's 60+ employees are creating urban freedom for active, healthy and sustainable communities around the world. BOND Mobility's approach has scientifically proved to replace car trips and to complement public transit, leading to a better public health and less pollution. With owned software and hardware platforms, BOND Mobility provides full-stack services to an increasingly large number of private customers and numerous B2B partners (e.g. Google, Siemens, ETH Zürich, etc). A unique AI-based fleet management system and smart user-incentives for rebalancing BOND Mobility's fleet are key elements for achieving operational profitability and driving exceptional customer satisfaction.For more information, please visit www.bond.info

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Frequently Asked Questions about Michiel Hamblok
Michiel Hamblok currently works for BOND Mobility.
Michiel Hamblok's role at BOND Mobility is Junior Hardware Engineer.
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Michiel Hamblok works in the Internet industry.
Michiel Hamblok's colleagues at BOND Mobility are Andy Nzemo, Lehel-Árpád Hankó, Sebastiaan Schaetzen, Cédric Sterckx, Jarni Vanmal, Brent Berghmans, Phil Duff and others.
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