Richard Silva

Test Technical Program Manager at Amkor Technology - Tempe, AZ, US

Richard Silva's Colleagues at Amkor Technology
Yna Dela

Associate Account Manager

Contact Yna Dela

Nima Parsizadeh

Sr Analyst, Customer Service

Contact Nima Parsizadeh

Yan Xu

Customer Service Analyst

Contact Yan Xu

Manuel Mendible

Director of Technical Program Management

Contact Manuel Mendible

Jon Aday

VP, Advanced Packaging Technology Integration

Contact Jon Aday

Chen-Ping Kuan

Technical Project Manager

Contact Chen-Ping Kuan

View All Richard Silva's Colleagues
Richard Silva's Contact Details
HQ
480-821-5000
Location
San Francisco Bay Area
Company
Amkor Technology
Richard Silva's Company Details
Amkor Technology logo, Amkor Technology contact details

Amkor Technology

Tempe, AZ, US • >10000 Employees
Semiconductors

Amkor Technology is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor's operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Semiconductors IC Test Package Design Wafer Bumping MEMS & Sensors Wafer Level Packaging Copper Pillar 3D Packaging TSV Copper Wirebond Flip Chip Package-on-Package SiP TMV Chip-on-Chip Wafer Test Die Processing & Inspection RF/Wireless Design Strip Test IC Design Leadframe Laminate WLFO Semiconductor CSP BGA Power Discretes MEMS & Sensors B2B Semiconductors and Related Devices
Details about Amkor Technology
Frequently Asked Questions about Richard Silva
Richard Silva currently works for Amkor Technology.
Richard Silva's role at Amkor Technology is Test Technical Program Manager.
Richard Silva's email address is ***@amkor.com. To view Richard Silva's full email address, please signup to ConnectPlex.
Richard Silva works in the Semiconductors industry.
Richard Silva's colleagues at Amkor Technology are Yna Dela, Nima Parsizadeh, Yan Xu, Manuel Mendible, Jon Aday, Roxanne Marie Atienza, Chen-Ping Kuan and others.
Richard Silva's phone number is 480-821-5000
See more information about Richard Silva