Wafering and Reclaim of SiC WafersX-trinsic's services include all process steps to transform a solid puck of SiC into epi-ready or device-ready prime wafers or reclaim existing your existing wafers. Capabilities include: SlicingEdge GrindingLapping or GrindingPolishing Cleaning SiC Consulting ServicesSiC consulting services including a wide range of functional areas including: Market development MarketingProduct ManagementSalesAccount ManagementProcess Technology Support