Scott Sikorski's Colleagues at STATS ChipPAC Ltd
Jacinta Lim
Director Wafer Level Packaging - Product and Development Engineering, North America
Scott Sikorski's Contact Details
510-979-8000
New York, New York County, New York, United States
STATS ChipPAC Ltd
Scott Sikorski's Company Details
JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET Group has three R&D centers, six manufacturing locations in China, Singapore and Korea, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in China and around the world.