Stephen Huff

Customer Service Manager at Amkor Technology - Tempe, AZ, US

Stephen Huff's Colleagues at Amkor Technology
Sheri Kennedy

Customer Service Analyst

Contact Sheri Kennedy

Rajesh Tiwari

Director Sales Account Management

Contact Rajesh Tiwari

Jeremias Libres

Senior Technical Program Manager

Contact Jeremias Libres

Eric Triplett

Sr Technical Program Manager (TPM)

Contact Eric Triplett

Ewald Nijhof

Technical Program Manager

Contact Ewald Nijhof

View All Stephen Huff's Colleagues
Stephen Huff's Contact Details
HQ
480-821-5000
Location
Austin, Texas, United States
Company
Amkor Technology
Stephen Huff's Company Details
Amkor Technology logo, Amkor Technology contact details

Amkor Technology

Tempe, AZ, US • >10000 Employees
Semiconductors

Amkor Technology is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor's operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Semiconductors IC Test Package Design Wafer Bumping MEMS & Sensors Wafer Level Packaging Copper Pillar 3D Packaging TSV Copper Wirebond Flip Chip Package-on-Package SiP TMV Chip-on-Chip Wafer Test Die Processing & Inspection RF/Wireless Design Strip Test IC Design Leadframe Laminate WLFO Semiconductor CSP BGA Power Discretes MEMS & Sensors B2B Semiconductors and Related Devices
Details about Amkor Technology
Frequently Asked Questions about Stephen Huff
Stephen Huff currently works for Amkor Technology.
Stephen Huff's role at Amkor Technology is Customer Service Manager.
Stephen Huff's email address is ***@amkor.com. To view Stephen Huff's full email address, please signup to ConnectPlex.
Stephen Huff works in the Semiconductors industry.
Stephen Huff's colleagues at Amkor Technology are Sheri Kennedy, Rajesh Tiwari, Cindi Millsaps, Jeremias Libres, Eric Triplett, Boudewijn Janssen, Ewald Nijhof and others.
Stephen Huff's phone number is 480-821-5000
See more information about Stephen Huff