IC Packaging Engineer at Hisilicon - N/A, , US
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Contact Jack Zheng
Foundry Technology Director
Contact Xiangming Xu
ATE Test Engineer
Contact Chun Heng
Kirin SOC Architect
Contact Boya Chen
Manager
Contact Shiwei Zhang
Principal R&D Engineer
Contact Bin Han
IC Design
Contact Susie Fan
www.hisilicon.com