Micross is the leading global one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for over 40 years, our extensive hi-reliability capabilities serve the global Aerospace & Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle. www.micross.comMicross'​ Advanced Test Facility, Silicon Turnkey Solutions (STS), located in Milpitas, CA is an industry-recognized collaborative partner that integrates design, engineering, manufacturing and qualification processes with operational expertise to provide leading edge technology and test services that enable customers to meet demanding time-to-market pressure, cost and technical challenges. Micross STS possesses more than 25 years of electronic test expertise. For additional information, visit www.sts-usa.com

Bare Die Die & Wafer Processing Component Modification Custom Packaging MIL-SPEC Connectors PEM-Quals Robotic Hot Solder Dipping BGA Chip Scale Packaging Engineering & Analytical Services Counterfeit Detection Full Turnkey Test Services CGA Counterfeit Mitigation Advanced Interconnect Technology Wafer Level Packaging Flip Chip/MCM Electrical & Environmental Test FPGA/ASIC Lead Attach Die & Wafer Processing Engineering & Analytical Services Electrical & Environmental Test Wafer Bumping BGA Reballing RF Testing Assembly Services Die Attach SMD/5962 Hi-Rel Products Hi-Rel Memory COTS Wafer Probe Hi-rel Microelectronic Components Column Attach Device Characterization Testing ASIC Design B2B Semiconductors Semiconductors and Related Devices