Vince Buffa

Chairman & CEO at Micross Components - Orlando, FL, US

Vince Buffa's Colleagues at Micross Components
Mike Fuggini

Senior VP Operations, Quality and Process Engineering

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Ed Whitbeck

Director of ERP Systems Integration and Data Analytics

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Giao Nguyen

Environment Health Safety Manager

Contact Giao Nguyen

Dana Fox

FA and Process Engineer

Contact Dana Fox

Dan Patterson

Equipment Engineering Manager

Contact Dan Patterson

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Vince Buffa's Contact Details
HQ
855-426-6766
Location
Huntington, New York
Company
Micross Components
Vince Buffa's Company Details
Micross Components logo, Micross Components contact details

Micross Components

Orlando, FL, US • 250 - 499 Employees
Semiconductors

Micross is the leading global one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for over 40 years, our extensive hi-reliability capabilities serve the global Aerospace & Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle. www.micross.comMicross'​ Advanced Test Facility, Silicon Turnkey Solutions (STS), located in Milpitas, CA is an industry-recognized collaborative partner that integrates design, engineering, manufacturing and qualification processes with operational expertise to provide leading edge technology and test services that enable customers to meet demanding time-to-market pressure, cost and technical challenges. Micross STS possesses more than 25 years of electronic test expertise. For additional information, visit www.sts-usa.com

Bare Die Die & Wafer Processing Component Modification Custom Packaging MIL-SPEC Connectors PEM-Quals Robotic Hot Solder Dipping BGA Chip Scale Packaging Engineering & Analytical Services Counterfeit Detection Full Turnkey Test Services CGA Counterfeit Mitigation Advanced Interconnect Technology Wafer Level Packaging Flip Chip/MCM Electrical & Environmental Test FPGA/ASIC Lead Attach Die & Wafer Processing Engineering & Analytical Services Electrical & Environmental Test Wafer Bumping BGA Reballing RF Testing Assembly Services Die Attach SMD/5962 Hi-Rel Products Hi-Rel Memory COTS Wafer Probe Hi-rel Microelectronic Components Column Attach Device Characterization Testing ASIC Design B2B Semiconductors Semiconductors and Related Devices
Details about Micross Components
Frequently Asked Questions about Vince Buffa
Vince Buffa currently works for Micross Components.
Vince Buffa's role at Micross Components is Chairman & CEO.
Vince Buffa's email address is ***@micross.com. To view Vince Buffa's full email address, please signup to ConnectPlex.
Vince Buffa works in the Semiconductors industry.
Vince Buffa's colleagues at Micross Components are Mike Fuggini, Ed Whitbeck, Giao Nguyen, Dana Fox, Dan Patterson, Michael Bucholz, Adam Rozelle and others.
Vince Buffa's phone number is 855-426-6766
See more information about Vince Buffa