Jon Kassam

Test Projects Director at Amkor Technology - Tempe, AZ, US

Jon Kassam's Colleagues at Amkor Technology
Gil Tily

Member, Board Of Directors

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Robert Lanzone

Sr. VP System in Package Product Line

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Kerry Quon

Manager II B2B / RosettaNet Integration

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Mark Gorecki

Staff Engineer - Design Automation R&D Design Center

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Jon Kassam's Contact Details
HQ
480-821-5000
Location
Swindon, England, United Kingdom
Company
Amkor Technology
Jon Kassam's Company Details
Amkor Technology logo, Amkor Technology contact details

Amkor Technology

Tempe, AZ, US • >10000 Employees
Semiconductors

Amkor Technology is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor's operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA.Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

Semiconductors IC Test Package Design Wafer Bumping MEMS & Sensors Wafer Level Packaging Copper Pillar 3D Packaging TSV Copper Wirebond Flip Chip Package-on-Package SiP TMV Chip-on-Chip Wafer Test Die Processing & Inspection RF/Wireless Design Strip Test IC Design Leadframe Laminate WLFO Semiconductor CSP BGA Power Discretes MEMS & Sensors B2B Semiconductors and Related Devices
Details about Amkor Technology
Frequently Asked Questions about Jon Kassam
Jon Kassam currently works for Amkor Technology.
Jon Kassam's role at Amkor Technology is Test Projects Director.
Jon Kassam's email address is ***@amkor.com. To view Jon Kassam's full email address, please signup to ConnectPlex.
Jon Kassam works in the Semiconductors industry.
Jon Kassam's colleagues at Amkor Technology are Gil Tily, Robert Lanzone, Danny Brady, John Sniegowski, Kerry Quon, Beverly Freet, Mark Gorecki and others.
Jon Kassam's phone number is 480-821-5000
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